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| A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Product Summary The MA series highlights performance in a wide range of rated voltage from 50 to 500V. These high Q capacitors are ideal for applications in the 1MHz to 1GHz range because they are designed with palladium/silver electrodes for low ESR and high Qs in this range. Constructed with a very low dielectric loss ceramic, this series is offered in P90 and C0G dielectrics in a cap range from 0.5 to 1000pF. Available in both 0505 and 1111 sizes. To meet medical imaging market standards, we offer nonmagnetic terminations with laser markings. MA Series: Features: Size: 0505 and 1111 Voltage: 50, 100, 150, 200, 300, 500VDC Cap Range: 0.5 to 1000pF Internal Electrode: Pd/Ag Termination: Pd/Ag + Ni/Sn plating ESR: Ultra Low Power: High Power (>5W) Frequency Range: 1MHz -1GHz. Tolerance: Tight Tolerance Available ([A]=+/-0.05pF for <=5pF, [B]=+/-0.1pF for 5 - 9.1pF, [C]=+/-0.25pF for 5 - 9.1pF, [F]=+/-1% for 10 - 20pF) Temp. Characteristics: C0G (-55C to 125C with 0 30ppm/C) and P90 (-55C to 125C with 90 20ppm/C) MA Series Applications: General purpose high frequency power circuits, medical imaging equipment, high frequency - high power radios, broadcast satellites, RF and base station power amplifiers 64 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Data Sheet Chip Structure Dielectric (Ceramic) Plating (Sn) Barrier (Ni) Inner Electrode (Pd/Ag) Termination (Ag/Pd) High Frequency/High Power MA Series Chip Dimensions W T e L g e Chip Dimensions Series MA10*/19 MA20*/29 MA59 MA69 *Nonmagnetic Unit: mm L 1.4+/-0.4 2.8 +/- 0.5 1.4+/-0.3 2.8+/-0.4 W 1.4+/-0.3 2.8 +/- 0.4 1.4+/-0.3 2.8+/-0.4 T max. 1.4 2.54 1.4 2.54 e max. 0.25+0.25/-0.15 0.38+/-0.25 0.25+0.25/-0.15 0.38+/-0.25 g min. 0.5 0.7 0.5 0.7 EIA size 0505 1111 0505 1111 Land Pattern Dimensions Chip Capacitor c Land Solder Resist b a Re-Flow Soldering Series a 0.5 ~ 0.8 0.5 ~ 0.8 b 0.8 ~ 0.9 0.8 ~ 0.9 c 1.0 ~ 1.2 1.0 ~ 1.2 MA10*/MA19 a 0.4 ~ 0.8 b 0.6 ~ 0.8 0.6 ~ 0.8 0.7 ~ 0.9 0.7 ~ 0.9 c 1.0 ~ 1.2 1.0 ~ 1.2 2.2 ~ 2.6 2.2 ~ 2.6 Flow Soldering Series MA10*/19 MA59 *Nonmagnetic MA59 0.4 ~ 0.8 MA20*/MA29 1.8 ~ 2.1 MA69 1.8 ~ 2.1 *Nonmagnetic Capacitance Range MA1* P90 MA2** P90 MA59 C0G MA69 C0G 150V 500V 300V 200V 100V 50V 150V 500V 300V 200V 100V 50V **MA20/MA29 Global Part Numbering MA 2 9 100 J A N C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 65 MA Series Series TC WV Capacitance Range 1pF 10pF 100pF 1000pF pF 0.5 to 82 pF 0.5 to 100 pF 110 to 200 pF 210 to 470 pF 510 to 620 pF 680 to 1000 pF 0.5 to 100 pF 0.5 to 100 pF 110 to 200 pF 220 to 470 pF 510 to 620 pF 680 to 1000 pF High Frequency ERB Series (1210 / C0G) A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors High Frequency / High Power MA Series MA Product Offering Product Offering MA10 Series (TC: P90) WV MA10 series Size 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 High Frequency Nonmagnetic Type for MRI Applications TC P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 MA20 Series (TC: P90) Global P/N Cap Cap Tol Murata MA19 Series (TC: P90) 1pF 2pF 3pF 4pF 5pF 6pF 7pF 8pF 9pF 10pF 12pF 15pF 18pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.5pF +/-0.5pF +/-0.5pF +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% MA101R0CBN MA102R0CBN MA103R0CBN MA104R0CBN MA105R0CBN MA106R0DBN MA107R0DBN MA108R0DBN MA109R0DBN MA10100JBN MA10120JBN MA10150JBN MA10180JBN MA10220JBN MA10270JBN MA10330JBN MA10390JBN MA10470JBN MA10560JBN MA10680JBN MA10820JBN High Frequency / Low Loss HPP1 Series 27pF 33pF 39pF 47pF 56pF 68pF 82pF High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V MA29 Series (TC: P90) MA59 Series (TC: C0G) MA69 Series (TC: C0G) 22pF MA Series High Frequency / Low Loss HPPC Series (TC P90) 66 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At iHigh Frequencyi/F i c Power MA Series r S o n S p e c High c A pA c i t o High Frequency Ceramic Capacitors MA Product Offering Product Offering MA10 Series (TC: P90) MA20 Series (TC: P90) WV High Frequency MA20 series Nonmagnetic Type for MRI Applications Size 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 TC P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 MA19Cap Cap Tol P90) Series (TC: Murata Global P/N 1pF 2pF 3pF 4pF 5pF 6pF 7pF 8pF 9pF 10pF 12pF 15pF 18pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.5pF +/-0.5pF +/-0.5pF +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% MA201R0CBN MA202R0CBN MA203R0CBN MA204R0CBN MA205R0CBN MA206R0DBN MA207R0DBN MA208R0DBN MA209R0DBN MA20100JBN MA20120JBN MA20150JBN MA20180JBN MA20220JBN MA20270JBN MA20330JBN MA20390JBN MA20470JBN MA20560JBN MA20680JBN MA20820JBN MA20101JBN MA20121JBN MA20151JBN MA20181JBN MA20221JBN MA20271JBN MA20331JBN MA20391JBN MA20471JBN MA20561JBN MA20681JBN MA20821JBN MA20102JBN High Frequency / Low Loss HPP1 Series High Frequency / Low Loss HPPC Series High Frequency / Low Loss HPPC Series (TC P90) 33pF 39pF 47pF 56pF 68pF 82pF 100pF 120pF 150pF 180pF 220pF 270pF 330pF 390pF 470pF 560pF 680pF 820pF 1000pF C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 67 MA Series 22pF High Frequency / Low Loss HPP1 Series (TC P90) 27pF 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 300V 300V 300V 200V 200V 200V 200V 200V 100V 50V 50V 50V MA29 Series (TC: P90) MA59 Series (TC: C0G) MA69 Series (TC: C0G) MA10 Series (TC: P90) A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Product Offering Product Offering MA20 Series (TC: P90) MA19 Series (TC: P90) High Frequency WV MA19 series Size 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 TC P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 MA29 Series (TC: P90) Cap Cap Tol 0.5pF 0.5pF 0.75pF 0.75pF 1pF 1pF 1.1pF 1.2pF 1.3pF 1.5pF 1.5pF 1.6pF 1.8pF 2pF 2pF 2.2pF 2.4pF 2.7pF 3pF 3pF 3.3pF 3.6pF 3.9pF 4pF 4pF 4.3pF 4.7pF 5pF 5pF 5.1pF 5.6pF 6pF 6pF 6.2pF 6.8pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF Murata Global P/N MA190R5BAN MA190R5CAN MA19R75BAN MA19R75CAN MA191R0BAN MA191R0CAN MA191R1BAN MA191R2BAN MA191R3BAN MA191R5BAN MA191R5CAN MA191R6BAN MA191R8BAN MA192R0BAN MA192R0CAN MA192R2BAN MA192R4BAN MA192R7BAN MA193R0BAN MA193R0CAN MA193R3BAN MA193R6BAN MA193R9BAN MA194R0BAN MA194R0CAN MA194R3BAN MA194R7BAN MA195R0BAN MA195R0CAN MA195R1CAN MA195R6CAN MA196R0CAN MA196R0DAN MA196R2CAN MA196R8CAN High Frequency / Low Loss HPP1 Series High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series High Frequency / Low Loss HPPC Series (TC P90) 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V MA59 Series (TC: C0G) MA69 Series (TC: C0G) MA Series 68 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n SMA10 Series (TC:A pA c i t o r S p e c i F i c c P90) High Frequency Ceramic Capacitors MA Product Offering MA19 series Size 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 MA20 Series (TC: P90) MA19 Series (TC: P90) High Frequency WV Product Offering TC P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 MA29 Series (TC: P90) Cap Cap Tol 7pF 7pF 7.5pF 8pF 8pF 8.2pF 9pF 9pF 9.1pF 10pF 10pF 12pF 12pF 15pF 15pF 18pF 18pF 22pF 22pF 27pF 27pF 33pF 33pF 39pF 39pF 47pF 47pF 56pF 56pF 68pF 68pF 82pF 82pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% Murata Global P/N MA197R0CAN MA197R0DAN MA197R5CAN MA198R0CAN MA198R0DAN MA198R2CAN MA199R0CAN MA199R0DAN MA199R1CAN MA19100GAN MA19100JAN MA19120GAN MA19120JAN MA19150GAN MA19150JAN MA19180GAN MA19180JAN MA19220GAN MA19220JAN MA19270GAN MA19270JAN MA19330GAN MA19330JAN MA19390GAN MA19390JAN MA19470GAN MA19470JAN MA19560GAN MA19560JAN MA19680GAN MA19680JAN MA19820GAN MA19820JAN High Frequency / Low Loss HPP1 Series High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series High Frequency / Low Loss HPPC Series (TC P90) 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V MA59 Series (TC: C0G) MA69 Series (TC: C0G) C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 69 MA Series A p p l i c At i o n S p e c i F i c c A pA c i t o r S MA20 Series (TC: P90) High Frequency Ceramic Capacitors MA Product Offering Product Offering MA19 Series (TC: P90) MA29 Series (TC: P90) High Frequency WV MA29 series Size 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 TC P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 MA59 Series (TC: C0G) Global P/N Cap Cap Tol Murata MA69 Series (TC: C0G) 0.5pF 0.5pF 0.75pF 0.75pF 1pF 1pF 1.1pF 1.2pF 1.3pF 1.5pF 1.5pF 1.6pF 1.8pF 2pF 2pF 2.2pF 2.4pF 2.7pF 3pF 3pF 3.3pF 3.6pF 3.9pF 4pF 4pF 4.3pF 4.7pF 5pF 5pF 5.1pF 5.6pF 6pF 6pF 6.2pF 6.8pF 7pF 7pF 7.5pF 8pF 8pF 8.2pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF MA290R5BAN MA290R5CAN MA29R75BAN MA29R75CAN MA291R0BAN MA291R0CAN MA291R1BAN MA291R2BAN MA291R3BAN MA291R5BAN MA291R5CAN MA291R6BAN MA291R8BAN MA292R0BAN MA292R0CAN MA292R2BAN MA292R4BAN MA292R7BAN MA293R0BAN MA293R0CAN MA293R3BAN MA293R6BAN MA293R9BAN MA294R0BAN MA294R0CAN MA294R3BAN MA294R7BAN MA295R0BAN MA295R0CAN MA295R1CAN MA295R6CAN MA296R0CAN MA296R0DAN MA296R2CAN MA296R8CAN MA297R0CAN MA297R0DAN MA297R5CAN MA298R0CAN MA298R0DAN MA298R2CAN High Frequency / Low Loss HPP1 Series High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series High Frequency / Low Loss HPPC Series (TC P90) 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V MA Series 70 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S MA20 i F i c (TC: P90) c i t o r S p e c Series c A pA High Frequency Ceramic Capacitors MA Product Offering Product Offering MA19 Series (TC: P90) MA29 Series (TC: P90) High Frequency WV MA29 series Size 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 TC P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 P90 MA59 Series (TC: C0G) Global P/N Cap Cap Tol Murata MA69 Series (TC: C0G) 9pF 9pF 9.1pF 10pF 10pF 12pF 12pF 15pF 15pF 18pF 18pF 22pF 22pF 27pF 27pF 33pF 33pF 39pF 39pF 47pF 47pF 56pF 56pF 68pF 68pF 82pF 82pF 100pF 100pF 120pF 150pF 180pF 220pF 270pF 330pF 390pF 470pF 560pF 680pF 820pF 1000pF +/-0.25pF +/-0.5pF +/-0.25pF +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% MA299R0CAN MA299R0DAN MA299R1CAN MA29100GAN MA29100JAN MA29120GAN MA29120JAN MA29150GAN MA29150JAN MA29180GAN MA29180JAN MA29220GAN MA29220JAN MA29270GAN MA29270JAN MA29330GAN MA29330JAN MA29390GAN MA29390JAN MA29470GAN MA29470JAN MA29560GAN MA29560JAN MA29680GAN MA29680JAN MA29820GAN MA29820JAN MA29101GAN MA29101JAN MA29121JAN MA29151JAN MA29181JAN MA29221JAN MA29271JAN MA29331JAN MA29391JAN MA29471JAN MA29561JAN MA29681JAN MA29821JAN MA29102JAN High Frequency / Low Loss HPP1 Series High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 71 MA Series High Frequency / Low Loss HPPC Series (TC P90) 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 300V 300V 300V 200V 200V 200V 200V 200V 100V 50V 50V 50V A p p l i c At i o n S p e c i F i c c A pA c i t o r S MA19 Series (TC: P90) High Frequency Ceramic Capacitors MA Product Offering Product O ering MA59 series Size 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 TC C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G WV MA29 Series (TC: P90) MA59 Series (TC: C0G) High Frequency MA69 Series (TC: C0G) Cap Cap Tol 0.5pF 0.5pF 0.75pF 0.75pF 1pF 1pF 1.1pF 1.2pF 1.3pF 1.5pF 1.5pF 1.6pF 1.8pF 2pF 2pF 2.2pF 2.4pF 2.7pF 3pF 3pF 3.3pF 3.6pF 3.9pF 4pF 4pF 4.3pF 4.7pF 5pF 5pF 5.1pF 5.6pF 6pF 6pF 6.2pF 6.8pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF Murata Global P/N MA590R5BAN MA590R5CAN MA59R75BAN MA59R75CAN MA591R0BAN MA591R0CAN MA591R1BAN MA591R2BAN MA591R3BAN MA591R5BAN MA591R5CAN MA591R6BAN MA591R8BAN MA592R0BAN MA592R0CAN MA592R2BAN MA592R4BAN MA592R7BAN MA593R0BAN MA593R0CAN MA593R3BAN MA593R6BAN MA593R9BAN MA594R0BAN MA594R0CAN MA594R3BAN MA594R7BAN MA595R0BAN MA595R0CAN MA595R1CAN MA595R6CAN MA596R0CAN MA596R0DAN MA596R2CAN MA596R8DAN High Frequency / Low Loss HPP1 Series High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series High Frequency / Low Loss HPPC Series (TC P90) 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V MA Series 72 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n SMA19 Series (TC:A pA c i t o r S p e c i F i c c P90) High Frequency Ceramic Capacitors MA Product Offering Product Offering MA29 Series (TC: P90) MA59 Series (TC: C0G) WV MA59 series Size 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 0505 TC C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G MA69 Series (TC: C0G) Cap Cap Tol 7pF 7pF 7.5pF 8pF 8pF 8.2pF 9pF 9pF 9.1pF 10pF 10pF 12pF 12pF 15pF 15pF 18pF 18pF 22pF 22pF 27pF 27pF 33pF 33pF 39pF 39pF 47pF 47pF 56pF 56pF 68pF 68pF 82pF 82pF 100pF 100pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% High Frequency Murata Global P/N MA597R0CAN MA597R0DAN MA597R5CAN MA598R0CAN MA598R0DAN MA598R2CAN MA599R0CAN MA599R0DAN MA599R1CAN MA59100GAN MA59100JAN MA59120GAN MA59120JAN MA59150GAN MA59150JAN MA59180GAN MA59180JAN MA59220GAN MA59220JAN MA59270GAN MA59270JAN MA59330GAN MA59330JAN MA59390GAN MA59390JAN MA59470GAN MA59470JAN MA59560GAN MA59560JAN MA59680GAN MA59680JAN MA59820GAN MA59820JAN MA59101GAN MA59101JAN High Frequency / Low Loss HPP1 Series High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series High Frequency / Low Loss HPPC Series (TC P90) 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V 150V C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 73 MA Series A p p l i c At i o n S p e c iSeries (TC: P90) c i t o r S MA29 F i c c A pA High Frequency Ceramic Capacitors MA Product Offering Product Offering MA59 Series (TC: C0G) MA69 Series (TC: C0G) High Frequency MA69 series Size 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 High Frequency / LowTol TC WV Cap Cap Loss HPP1 Series Murata Global P/N C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 0.5pF 0.5pF 0.75pF 0.75pF 1pF 1pF 1.1pF 1.2pF 1.3pF 1.5pF 1.5pF 1.6pF 1.8pF 2pF 2pF 2.2pF 2.4pF 2.7pF 3pF 3pF 3.3pF 3.6pF 3.9pF 4pF 4pF 4.3pF 4.7pF 5pF 5pF 5.1pF 5.6pF 6pF 6pF 6.2pF 6.8pF 7pF 7pF 7.5pF 8pF 8pF 8.2pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.1pF +/-0.1pF +/-0.1pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF +/-0.25pF +/-0.5pF +/-0.25pF MA690R5BAN MA690R5CAN MA69R75BAN MA69R75CAN MA691R0BAN MA691R0CAN MA691R1BAN MA691R2BAN MA691R3BAN MA691R5BAN MA691R5CAN MA691R6BAN MA691R8BAN MA692R0BAN MA692R0CAN MA692R2BAN MA692R4BAN MA692R7BAN MA693R0BAN MA693R0CAN MA693R3BAN MA693R6BAN MA693R9BAN MA694R0BAN MA694R0CAN MA694R3BAN MA694R7BAN MA695R0BAN MA695R0CAN MA695R1CAN MA695R6CAN MA696R0CAN MA696R0DAN MA696R2CAN MA696R8DAN MA697R0CAN MA697R0DAN MA697R5CAN MA698R0CAN MA698R0DAN MA698R2CAN High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series High Frequency / Low Loss HPPC Series (TC P90) MA Series 74 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i Series (TC: pA c i t o r S MA29 F i c c A P90) High Frequency Ceramic Capacitors MA Product Offering MA69 series Size 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 MA59 Series (TC: C0G) MA69 Series (TC: C0G) High Frequency Product Offering High Frequency / Low Loss HPP1 Global P/N TC WV Cap Cap Tol Murata Series C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 500V 300V 300V 300V 200V 200V 200V 200V 200V 100V 50V 50V 50V 9pF 9pF 9.1pF 10pF 10pF 12pF 12pF 15pF 15pF 18pF 18pF 22pF 22pF 27pF 27pF 33pF 33pF 39pF 39pF 47pF 47pF 56pF 56pF 68pF 68pF 82pF 82pF 100pF 100pF 120pF 150pF 180pF 220pF 270pF 330pF 390pF 470pF 560pF 680pF 820pF 1000pF +/-0.25pF +/-0.5pF +/-0.25pF +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-2% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% +/-5% MA699R0CAN MA699R0DAN MA699R1CAN MA69100GAN MA69100JAN MA69120GAN MA69120JAN MA69150GAN MA69150JAN MA69180GAN MA69180JAN MA69220GAN MA69220JAN MA69270GAN MA69270JAN MA69330GAN MA69330JAN MA69390GAN MA69390JAN MA69470GAN MA69470JAN MA69560GAN MA69560JAN MA69680GAN MA69680JAN MA69820GAN MA69820JAN MA69101GAN MA69101JAN MA69121JAN MA69151JAN MA69181JAN MA69221JAN MA69271JAN MA69331JAN MA69391JAN MA69471JAN MA69561JAN MA69681JAN MA69821JAN MA69102JAN High Frequency / Low Loss HPP1 Series (TC P90) High Frequency / Low Loss HPPC Series High Frequency / Low Loss HPPC Series (TC P90) C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 75 MA Series A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Specifications and Test Methods No Item Specifications C0G, P090: -55C to 125C See the previous page. Test Methods The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, V P-P or V O-P, whichever is larger, should be maintained within the rated voltage range. Visual inspection. Using calipers. No failure should be observed when 250% of the rated voltage is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. The insulation resistance should be measured with a DC voltage not exceeding the rated voltage at 25C and 125C, standard humidity and within 2 minutes of charging. The capacitance/Q should be measured at 25C at the frequency and voltage shown in the table. Char. Item Frequency Voltage 1000pF and below 10.1MHz 10.2Vrms More than 1000pF 10.1kHz 10.2Vrms 1 Operating Temperature 2 Rated Voltage 3 Appearance 4 Dimension 5 Dielectric Strength No defects or abnormalities. Within the specified dimensions. No defects or abnormalities. 6 Insulation Resistance (I.R.) 7 Capacitance 8Q 25C 125C 1,000,000M 100,000M min. min. Within the specified tolerance. C0G Q 667 P090 Q 2000 9 Capacitance Capactance Temperature Change Characteristics Within the specified tolerance (Table A-1) Temperature Within the specified tolerance (Table A-1) Coefficent The capacitance change should be measured after 5 min. at each specified temp. stage. The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5, the capacitance should be within the specified tolerance for the temperature coefficient and capacitance change as Table A-1. The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in the step 1, 3 and 5 by the cap. value in step 3. Step 1 2 3 4 5 Temperature (C) 252 -553 252 1253 252 MA Series Capacitance Drift Within 0.2% or 0.05pF (whichever is larger) 10 Terminal strength Adhesive No removal of the terminations or other defect Strength of should occur. Termination (for chip type) Solder the capacitor to the test jig (alumina substrate) shown in Fig.1 using solder containing 2.5% silver. The soldering should be done either with an iron or in a furnace and be conducted with care the soldering is uniform and free of defects such as heat shock. Then apply 10N* force in the direction of the arrow. *(5N for MA1 10N* Fig. 1 Alumina substrate 5) Tensile Capacitor should not be broken or damaged. Strength (for microstrip type) Bending Lead wire should not be cut or broken. Strength of Lead Wire Terminal (for microstrip type) The capacitor body is fixed and a load is applied gradually in the axial direction until its value reaches 5N. Position the main body of the capacitor so the lead wire terminal is perpendicular, and load 2.5N to lead wire terminal. Bend the main body by 90 degrees, bend back to original position, bend 90 degrees in the reverse direction, and then bend back to original position. 76 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Specifications and Test Methods No 11 Vibration Resistance Item Appearance Capacitance Q Specifications No defects or abnormalities. Within the specified tolerance. C0G: Q 667 P090: Q 2000 Test Methods Solder the capacitor to the test jig (alumina substrate) shown in Fig.2 using solder containing 2.5% silver. The soldering should be done either with an iron or using the reflow method and should be conducted with care so the soldering is uniform and free of defects such as heat shock. The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 2000Hz. The frequency range, from 10 to 2000Hz and return to 10Hz, should be traversed in approximately 20 minute. This motion should be applied for a period of 4 hours in each of 3 mutually perpendicular directions (total of 12 hours). Fig. 2 12 Solderability of Termination 95% of the terminations are to be soldered evenly and continuously. Solder resist Baked electrode or copper foil 13 Resistance to Soldering Heat Appearance Capacitance Change Q I.R. Dielectric Strength 14 Temperature Cycle Appearance Capacitance Change Q I.R. Dielectric Strength The measured and observed characteristics should Preheat the capacitor at 80 to 100C for 2 minutes and then at 150 to 200C for 5 minutes. satisfy the specifications in the following table. Immerse the capacitor in solder containing 2.5% silver or Sn3.0Ag-0.5Cu solder solution for 30.5 seconds at 2705C. No marking defects. Set at room temperature for 242 hours, then measure. Within 2.5% or 0.25 pF The dipping depth for microstrip type capacitors is up to 2mm (whichever is larger) from the root of the terminal. C0G: Q 667 P090: Q 2000 More than 30% of the initial specification value at 25C No failure The measured and observed characteristics should Fix the capacitor to the supporting jig in the same manner and under the same conditions as (11). Perform the five cycles satisfy the specifications in the following table. according to the four heat treatments isted in the following No marking defects. table. Let sit for 24 2 hours at room temperature, then measure. Within 1% or 0.25pF (whichever is larger) C0G: Q 667 P090: Q 2000 Step Temp (C) Time (min.) 1 -55 +0/-3 303 2 Room Temp 5max 3 85 +3/-0 303 4 Room Temp 5max More than 30% of the initial specification value at 25C No failure 15 Humidity Appearance Capacitance Change Q I.R. C0G: Q 667 P090: Q 2000 More than 30% of the initial specification value at 25C The measured and observed characteristics should Apply the 24-hour heat (-10 to +65C) and humidity ( 80 to 100%) treatment shown below, 10 consecutive times. satisfy the specifications in the following table. Remove and set for 242 hours at room temperature, then No marking defects. measure. Within 5% or 0.5pF It is based on Fig 3 for details. (whichever is larger) C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 77 MA Series Immerse the capacitor in a solution of isopropyl alcohol and rosin (25% rosin in weight propotion). Preheat at 80 to 120C for 10 to 30 seconds. After preheating , immerse in eutectic solder solution or Sn3.0Ag-0.5Cu solder solution for 50.5 seconds at 2455C. The dipping depth for microstrip type capacitors is up to 1mm from the root of the terminal. A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Specifications and Test Methods No No 16 High Temperature No Load Item Load 16 High Temperature Item Item The should satisfy andspecifications incharacteristics ApplyRemove and set forrated hours at room temperature, hours at measured the observed the following 1253C. 150% of the 242 voltage for 200012 Specifications Test Methods should satisfy the specifications in the following 1253C. The charge/discharge current ishours at 50mA. temperature, then measure. Remove and set for 242 less than room table. 16 High Temperature Appearance No marking defects. observed characteristics Apply 150% of the The charge/discharge current is less than 50mA. then measure. rated voltage for 200012 hours at table.The measured and Load should satisfy the specifications in the following 1253C. Remove and set for 242 hours at room temperature, Appearance No marking defects. then measure. The charge/discharge current is less than 50mA. table. Capacitance Within 2.5% or 0.25pF Appearance (whichever isdefects. No marking larger) Change Capacitance Within 2.5% or 0.25pF Q C0G: Q 667 Within 2.5% or ChangeCapacitance P090: Q larger)0.25pF (whichever is 2000 Change (whichever is larger) Q C0G: Q than 30% of the initial specification value I.R. More 667 Q C0G: at 25CQ 667 P090: Q 2000 P090: Q 2000 The measured and observed characteristics Apply 150% of the rated voltage for 200012 hours at Specifications Specifications Test Methods Test Methods I.R. I.R. More More than 30% the initial specification value than 30% of of the initial specification value at 25C25C at Table A-1 Table A-1 Char. C0G P90 Char. Table A-1 Capacitance Change from 25C % 30 --10 Max. Min. Max. Min. Max. Capacitance Change from 25C % C0G 0 Values 0.58 -0.24 0.40 -0.17 0.25 Nominal 30 Char. - 55 30 --10 (ppm/ ) Note 1 Capacitance Change from 25C %Max. Max. Min. Max. Min. P90Nominal Values 20 P90 -0.56 -0.88 -0.38 -0.61 -0.24 - 55 30 C0G 0 0.58 -0.24 0.40 -0.17 0.25 (ppm/ ) values1 Note 30 Note Nominal denote the temperature coefficient within a range of 25C toMax. 125C. Max. Min. Min. Max. Nominal Values (ppm/ ) Note 1 - 55 P90 Note Nominal values denote the temperature coefficient within a range of 25C to 125C. -0.11 Min. -0.39 --10 -0.11 Min. 0 30P90 20 -0.56 0.58 -0.88 -0.24 80 100 -0.38 0.40 -0.61 -0.17 Humidity 90 100 -0.24 0.25 -0.39 -0.11 -0.39 Min. MA Series Note 70 Initial Nominal values65 a dry oven 24 temperature coefficient denote Conditioning in the hours. 60 Humidity 55 90 100 50 70 Initial Conditioning in 45 65 a dry oven 24 hours. 40 60 Humidity 35 55 Uncontrolled Humidity 30 50 90 100 25 45 70 20 40 Initial Conditioning in Humidity 65 15 Initial measurements 35 a dry oven 24Uncontrolled hours. 60 10 30 5 25 55 0 20 50 -5 15 Initial measurements 45 -10 10 40 5 Humidity 35 0 Uncontrolled 30 -5 -10 25 P90 20 -0.56 90 Humidity 100 -0.88 Humidity Humidity 90 100 Humidity -0.38 100 80 -0.61 -0.24 within a range of 25C to 125C. Humidity 80 100 Humidity 90 100 Humidity 80 100 Humidity 90 100 Humidity 80 100 +10/-2 Humidity 90 100 Humidity 80 100 End or final cycle measurements Humidity 90 100 End or final cycle measurements Bibra +10/-2 Bibra End or final cycle measurements Step a Step b Applied voltage 50Vdc 20 15 10 5 0 -5 -10 Initial measurements Prior to first cycle unless otherwise specified Step 1 Step 2 Applied voltage 50Vdc +10/-2 Step 7a and 7b performed during any 5 of the first 9 cycles. Humidity uncontrolled during Step 7a and 7b only. Step 3 Step 4 Step 5 Step 6 Step a Step 7 Step b Bibra Step 7a and 7b performed during any 5 of the first 9 cycles. Humidity uncontrolled during Step 7a and 7b only. One cycle 24 hours Step 5 Step 6 Prior to first cycle unless 0 otherwise specified Step 1 1 2 3 Step 2 4 5 Step 3 Step 4 Applied voltage 50Vdc 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 One cycle 24 hours Hours Step 7 24 0 1 2 3 4 5 6 7 Fig 8 Step 7a and 7b performed during any 5 of the first 9 cycles. Hours Humidity uncontrolled during Step 7a and 7b only. 39 Step a 24 Step b 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Prior to first cycle unless otherwise specified Step 1 Step 2 Step 3 Fig 3 Step 4 Step 5 Step 6 Step 7 One cycle 24 hours 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Hours Fig 3 78 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Technical Data (Typical) MA Capacitance - Temperature Characteristics C0G and P90 Characteristics 2.5 2.0 1.5 P90 Spec. (upper) 1.0 CAPACITANCE CHANGE (%) P90 Spec. (lower) 0.5 C0G Spec. (upper) 0.0 C0G -0.5 C0G Spec. (lower) -1.0 P90 -1.5 -2.0 -2.5 CERAMIC HIQ CAPACITOR Technical Data (Typical) TEMPERATURE (C) Resonant Frequency Characteristics Resonant Frequency Characteristics MA Series 10G RESONANT FREQUENCY (Hz) MA10/MA19/MA59 1G MA20/MA29/MA69 100M G 1 10 CAPACITANCE (pF) 1 00 C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 79 MA Series A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Technical Data (Typical) CERAMIC HIQ CAPACITOR Technical Data (Typical) CERAMIC ESR - Frequency Characteristics(Typical) HIQ CAPACITOR Technical Data ESR - Frequency Characteristics MA10/MA19 Series 10 ESR - Frequency Characteristics 1pF MA10/MA19 Series 10 1 ESR (ohm) 10pF 100pF Measurement Equipment Boonton Resonant Coaxial-Line 34A Measurement Equipment Boonton Resonant Coaxial-Line 34A 1pF 10pF 100pF 1 0 .1 ESR (ohm) 01 0 .0.1 100M 1G 1000M FREQUENCY (Hz) 10G 10000M ESR (ohm) ESR (ohm) MA Series 0 .0 1 10 00M 1 MA20/MA29 Series 1G 1000M FREQUENCY (Hz) 10G 10000M 1 pF 1 0pF 1 00pF MA20/MA29 Series 10 1 1 pF 1 0pF 1 00pF 1 0 .1 0 .1 0 .0 1 100M 1G 1000M FREQUENCY (Hz) 10G 10000M 0 .0 1 100M 1G 1000M FREQUENCY (Hz) 10G 10000M 80 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors CERAMIC HIQ CAPACITOR Technical Data (Typical) MA Technical Data (Typical) CERAMIC HIQ CAPACITOR Technical Data (Typical) ESR - Frequency Characteristics ESR - Frequency Characteristics ESR - Frequency Characteristics MA59 Series 10 MA59 Series 10 1 ESR (ohm) ESR (ohm) 1pF 10pF 100pF 1pF 10pF 100pF Measurement Equipment Boonton Resonant Coaxial-Line 34A Measurement Equipment Boonton Resonant Coaxial-Line 34A 1 0 .1 0 .1 0 .0 1 100M 0 .0 1 100M 1G 1000M FREQUENCY (Hz) 10G 10000M 1G 1 00M MA690Series FREQUENCY (Hz) 10G 10000M 10 MA69 Series 10 1 ESR (ohm)ESR (ohm) 4.7pF 10pF 100pF 4.7pF 10pF 100pF 1 0 .1 0 .1 0 .0 1 100M 0 .0 1 100M 1G 1000M FREQUENCY (Hz) 10G 10000M 1G 1000M FREQUENCY (Hz) 10G 10000M C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 81 19 MA Series A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Technical Data (Typical) CERAMIC HIQ CAPACITOR Technical Data (Typical) Q - Frequency Characteristics CERAMIC HIQ CAPACITOR Technical Data (Typical) Q - Frequency Characteristics MA10/MA19 Series 10000 Q - Frequency Characteristics 1pF 1000 10000 MA10/MA19 Series 10pF 100pF Measurement Equipment Boonton Resonant Coaxial-Line 34A Measurement Equipment Boonton Resonant Coaxial-Line 34A 1pF 10pF 100 1000 Q 100pF 10 100 Q 1 1 10 00M 1G 1000M FREQUENCY (Hz) 1 1 0 G0 M 000 Q Q MA Series 1 1 10000 00M MA20/MA29 Series 1G 1000M FREQUENCY (Hz) 1 1 0 G0 M 000 1pF 10pF 100pF 1000 10000 MA20/MA29 Series 1pF 10pF 100 1000 100pF 10 100 1 10 00M 1 1G 1000M FREQUENCY (Hz) 1 1 0 G0 M 000 1 100M 1G 1000M FREQUENCY (Hz) 1 1 0 G0 M 000 82 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C 20 A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Technical Data (Typical) CERAMIC HIQ CAPACITOR Technical Data (Typical) CERAMIC HIQ CAPACITOR Technical Data (Typical) Q - Frequency Characteristics Q - Frequency Characteristics Q - Frequency Characteristics MA59 Series 10000 MA59 Series 10000 1000 1pF 10pF 100pF 1pF 10pF 100pF Measurement Equipment Boonton Resonant Measurement Coaxial-Line 34A Equipment Boonton Resonant Coaxial-Line 34A 1000 100 Q Q 100 10 10 1 100M 1 100M 10000 1G 1000M FREQUENCY (Hz) MA69 Series FREQUENCY (Hz) 1G 1000M 1 1 0 G0 M 000 MA69 Series 10000 1000 4.7pF 10pF 100pF 4.7pF 10pF 100pF 1000 100 Q 100 10 Q 10 1 100M 1 100M 1G 1000M FREQUENCY (Hz) 1 1 0 G0 M 000 1G 1000M FREQUENCY (Hz) 1 1 0 G0 M 000 C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 83 21 MA Series 1 1 0 G0 M 000 A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors CERAMIC HIQ CAPACITOR Technical Data (Typical) MA Technical Data (Typical) Temperature Rise - - Current Characteristics Temperature Rise Current Characteristics MA20/MA29 Series (100MHz) 10.0 8.0 1pF 10pF 100pF Temp.Rise (C) 6.0 4.0 2.0 CERAMIC HIQ CAPACITOR Technical Data (Typical) 0.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 CURRENT(Arms) Temperature Rise - Current Characteristics Temp. Rise (C) Temp.Rise (C) MA Series 10.0 10.0 MA20/MA29 Series (100MHz) MA10/MA19 Series (100MHz) 8.0 8.0 1pF 10pF 1.0pF 82pF 100pF 6.0 6.0 4.0 4.0 2.0 2.0 0.0 0 0.0 0 0.1 0.1 0.2 0.2 0.3 0.3 CURRENT(Arms) 0.4 0.5 CURRENT (Arms) 0.4 0.5 0.6 0.6 0.7 0.7 0.8 0.8 22 84 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Soldering and Mounting Soldering & Mounting Section for MA Series CAUTION Soldering & Mounting Section for MA Series Limitation of use CAUTION Please contact our sales representatives MA Series Soldering & Mounting Section for or product engineers before using our products for the applications Limitation of use listed below which require use of our products for other applications than specified in this listing. CAUTION Please contact our sales Aerospace equipment representatives or product engineers before using our products control equipment Aircraft equipment Undersea equipment Power plant for the applications Soldering &which require use of our products for other applications than specified in this listing. listed below Mounting Section for MA Series Limitation of use Medical equipment Transportation equipment (vehicles, trains, ships, etc.) Traffic signal equipment Aircraft equipment Undersea equipment equipmentplant for the applications Power Please contact our sales Aerospace equipment representatives or product CAUTION Disaster prevention / crime prevention equipment engineers before using our products control equipment Data-processing Medical equipment Transportation or reliability requirements to the specified Traffic above. listed below which require use of our products for other applications thanapplications listed signal equipment Application of similar complexity and / equipment (vehicles, trains, ships, etc.) in this listing. Limitation of use Disaster prevention / crime prevention equipment Data-processing Aircraft equipment Aerospace equipment Undersea equipment equipmentplant control equipment Power Please contact our sales representatives or product engineers before using our products for the applications Application of similar complexity and / equipment (vehicles, trains, ships, etc.) Medical equipment Transportation or reliability requirements to the applications listed signal equipment Traffic above. CAUTION listed below which require use of our products for other applications than specified in this listing. Disaster prevention / crime prevention equipment Data-processing equipment Storage and Operating Conditions Aircraft equipment Aerospace equipment Undersea equipment Power plant control equipment CAUTION or reliability requirements to the of termination solderability when subjected to above. 1. Application of similar complexity and / equipment (vehicles,degradationapplications listed signal equipment Chip monolithic ceramic capacitors (chips) can experience trains, ships, etc.) Medical equipment Transportation Traffic Storageprevention humidity, or if exposed to sulfur Data-processing and Operating Conditions high temperature or / crime prevention equipment or chlorine gases. equipment Disaster 1. Storage environment must be at an (chips) can experience degradation of termination solderability when subjected to Chip monolithic ceramic capacitors CAUTION of similar complexity andambient temperatureof 5-40to the applications listed above. 20-70%RH. Use chip Application / or reliability requirements C. and an ambient humidity of high temperatureIf 6 humidity,or more have elapsed, check solderability before use. (Reference Data 1/ Solderability) Storage and Operating Conditions within 6 months. or months or if exposed to sulfur or chlorine gases. Storage environment shall be deteriorated intemperatureof 5-40 C. and an ambient corrosive gas when as Use chip 1. Insulation Resistance must be at an (chips) can experience degradationhumidity or in humidity of 20-70%RH.hydrogen Chip monolithic ceramic capacitors ambient specific condition of high of termination solderability such subjected to CAUTION within 6 sulfurous acid gas, cholorine. have to sulfur or chlorine suitable for use. high temperatureIf 6 humidity, or if exposedelapsed, check solderability before use. (Reference Data 1/ Solderability) sulfide, months. or months or more Those conditions are not gases. Storage and Operating Conditions an ambient specific condition Please Use chip Insulation Resistance solderbe atdeteriorate can experience degradationhumidityMuratasolderability when as hydrogen deteriorated reliability of MLCC. of high contact or in corrosivefor the usesubjected 2.Storage environment must Use monolithic ceramic capacitors (chips) intemperatureof 5-40 C. and an ambient humidity of 20-70%RH. Sn-Zn to 1. Chip of Sn-Zn based shall will of termination factory gas such of sulfide, solder in advance. cholorine. have elapsed, check solderability before use. (Reference Data 1/ Solderability) within 6 sulfurousIf 6 months or more Those conditions are not suitable for use. months. acid gas, based high temperature or humidity, or if exposed to sulfur or chlorine gases. 2.Insulation Resistance solderbe deteriorated in specificof MLCC. of high humidityMurata factory for the useas hydrogen Use of Sn-Zn based shall will deteriorate reliability condition Please contact or in corrosive gas such of Sn-Zn Storage environment must be at an ambient temperatureof 5-40 C. and an ambient humidity of 20-70%RH. Use chip sulfide, solder Those conditions are not suitable for use. based sulfurous acid gas, CAUTION in advance. cholorine. have elapsed, check solderability before use. (Reference Data 1/ Solderability) within 6 months. If 6 months or more 2. Handling Use of Sn-Zn based solder will deteriorate reliability of MLCC. Please contact Murata factory for the use of Sn-Zn Insulation Resistance shall be deteriorated in specific condition of high humidity or in corrosive gas such as hydrogen CAUTION in advance. cholorine. Those conditions are not suitable for use. 1. based solder Inspection sulfide, sulfurous acid gas, Thrusting 2.Handling force of the test probe can flex the PCB, resulting in cracked chips or open solder joints. Provide Board Separation (or Depanelization) support 1. Inspectionpins on the time of separation causes cracked chips or broken solder. Board flexing at the back side of the PCB to prevent warping or flexing. CAUTION 2. Board Separationof the test probe can chip at the time of board break is in the order of: Pushback Continued on the following page. C-29-C w w w . m u r a t a . c o m Continued from the preceding page. Innovator in Electronics - 85 MA Series 1. Inspection CAUTION pins on the back side of the PCB to prevent warping or flexing. support based solder in advance. Thrusting force of solder probe can flex the PCB, resulting Please contact or open solder joints. Provide 2. Use of Sn-Zn basedthe testwill deteriorate reliability of MLCC.in cracked chipsMurata factory for the use of Sn-Zn Handling A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Soldering and Mounting 2.Chip Placing An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. So adjust the suction nozzle's bottom dead point by correcting warp in the board. Normally, the suction nozzle's bottom dead point must be set on the upper surface of the board. Nozzle pressure for chip mounting must be a 1 to 3N static load. Incorrect Suction Nozzle Correct Board Deflection Board Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving smoothly. This imposes great force on the chip during mounting, causing cracked chips. And the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained, checked and replaced periodically. Support Pin Standard Conditions for Reflow Soldering Infrared Reflow Temperature (C) Peak temperature 200C 170C 150C 130C T Soldering Gradual Cooling 3.Caution for Soldering (1) Reflow Soldering When the sudden heat is given to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity of components inside. In order to prevent mechanical damage in the components, preheating should be required for both of the components and the PCB board. Preheating conditions are shown in Table 1. It is required to keep temperature differential between the soldering and the components surface ( T) as small as possible. Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. When components are immersed in solvent after mounting, be sure to maintain the temperature difference ( T) between the component and solvent within the range shown in Table 1. Table 1 Part Number MA1*/MA5* MA2*/MA6* Recommended Conditions Pb-Sn Infrared Reflow Peak Temperature Atmosphere 230-250C Air Temperature Differential T 190C T 130C Solder Vapor Reflow 230-240C Air Lead Free Solder 240-260C Air or N2 Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Soldering temperature(C) MA Series Preheating 60-120 seconds Time 30-60 seconds Vapor Reflow Temperature (C) Peak temperature T Soldering Gradual Cooling 170C 150C 130C Preheating 60-120 seconds Time 20 seconds max. Allowable Soldering Temperature and Time 280 270 260 250 240 230 220 0 30 60 90 120 Soldering time(sec.) In case of repeated soldering, the accumulated soldering time must be within the range shown above. Continued on the following page. 86 - Innovator in Electronics w w w . m u r a t a . c o mContinued from the preceding page. C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Soldering and Mounting Optimum Solder Amount for Reflow Soldering Overly thick application of solder paste results in excessive fillet height solder. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause cracked chips. Too little solder paste results in a lack of adhesive strength on the outer electrode, which may result in chips breaking loose from the PCB. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min. Optimum Solder Amount for Reflow soldering 0.2mm min. Inverting the PCB Make sure not to impose an abnormal mechanical shock on the PCB. (2) Leaded Component Insertion If the PCB is flexed when leaded components (such as transformers and lCs) are being mounted, chips may crack and solder joints may break. Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping. (3) Flow Soldering When the sudden heat is given to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity of components inside. And an excessively long soldering time or high soldering temperature results in leaching of the outer electrodes, causing poor adhesion or a reduction in capacitance value due to loss of contact between electrodes and end termination. In order to prevent mechanical damage in the components, preheating should be required for both of the components and the PCB board. Preheating conditions are shown in Table 2. It is required to keep temperature differential between the soldering and the components surface ( T) as small as possible. When components are immersed in solvent after mounting, be sure to maintain the temperature difference between the component and solvent within the range shown in Table 2. Do not apply flow soldering to chips not listed in Table 2. Table 2 Standard Conditions for Flow Soldering Peak temperature T Soldering Gradual Cooling 170C 150C 130C Preheating 60-120 seconds Time 5 seconds max. Allowable Soldering Temperature and Time Part Number MA1*/MA5* (MA10/50 type: Not apply) Recommended Conditions Pb-Sn Solder Peak Temperature Atmosphere 240-250C Air Temperature Differential T 150C In case of repeated soldering, the accumulated soldering time must be within the range shown above. Lead Free Solder 250-260C N2 Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Continued on the following page. C-29-C w w w . m u r a t a . c o m Innovator preceding page. Continued from thein Electronics - 87 MA Series Temperature (C) A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Soldering and Mounting Optimum Solder Amount for Flow Soldering The top ofSolder Amount for Flowbe lower than the Optimum the solder fillet should Soldering thickness the solder fillet If the solder amount the The top ofof components. should be lower thanis excessively components. cracking is amount is thickness of big, the risk ofIf the solder higher during board Optimum Solder Amount for Flow Soldering bending or under any othercracking is higher during board excessively big, the risk of stressful conditions. Up to Chip Thickness The top of the solder fillet should be lower than the Adhesive bending or under any other stressful conditions. Up to Chip Thickness thickness of components. If the solder amount is Adhesive excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. Up to Chip Thickness (4) Correction with a Soldering Iron Adhesive When the sudden Soldering Iron (4) Correction with a heat is given to the components by soldering iron, the mechanical strength of the components should go down because remarkable temperature change causes deformity of components inside. Incomponents When the sudden heat is given to the components by soldering iron, the mechanical strength of the order to prevent mechanical damage in the components, preheating shouldcauses deformity of components inside. and the PCB board. should go down because remarkable temperature change be required for both of the components In order to prevent (4) Correction with a Soldering Iron mechanical damage in the components, preheating should be required for both of the components and the PCB board. When the sudden heat is given to the components by soldering iron, the mechanical strength of the components Preheating conditions are shown in Table 3. It is required to keep temperature differential between the soldering and should go down because remarkable temperature change causes deformity of components inside. In order to prevent the components surface ( T) as in Table 3. It is required to keep temperature differential it down the soldering and Preheating conditions are shownsmall as possible. After soldering, it is not allowed to coolbetweenrapidly. mechanical damage in the components, preheating should be required for both of the components and the PCB board. the components surface ( T) as small as possible. After soldering, it is not allowed to cool it down rapidly. Preheating conditions are shown in Table 3. It is required to keep temperature differential between the soldering and Table 3 the components surface ( T) as small as possible. After soldering, it is not allowed to cool it down rapidly. Table 3 Part Temperature Peak Number Part Number Table 3 MA1*/MA5* Part MA1*/MA5* Number MA2*/MA6* MA1*/MA5* MA2*/MA6* Differential Temperature Differential T 190C Temperature T 190C Differential Atmosphere Atmosphere Air Atmosphere Air Air Air Air Air Temperature Peak Temperature 300C max. 3 seconds max./ 300C max. Peak termination 3 seconds max./ Temperature termination 270C max. 300C max. T 130C 3 270C max. seconds max./ T 190C 3 seconds max./ T 130C 3 termination seconds max./ termination termination *Applicable for both Pb-Sn and Lead Free Solder 270C max. MA2*/MA6* *Applicable for both Pb-Sn and Lead3 seconds max./ Free Solder T Pb-Sn Solder: Sn-37Pb 130C Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu termination Lead Free for both Pb-Sn and Lead *Applicable Solder: Sn-3.0Ag-0.5Cu Free Solder MA Series Pb-Sn Solder: Sn-37Pb Optimum Solder Amount when Corrections Are Made Using a Soldering Iron The top ofSolder Sn-3.0Ag-0.5Cu Corrections Are the thicknessa Soldering Iron If the solder amount is Optimum Solder: Amount when be lower than Made Using of components. Lead Free the solder fillet should excessively big, the risk of cracking lower than the board bending or under any other stressful conditions. The top of the solder fillet should be is higher duringthickness of components. If the solder amount is excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. Optimum Solder Amount when Corrections Are Made Using a Soldering Iron Soldering iron 3mm or smaller should be required. The top of the solder fillet should be lower than the thickness of components. If the solder amount is And it is necessary to or smaller shouldbetween the Soldering iron 3mm keep a distance be required. excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. soldering iron and the keep a distance between the And it is necessary to components without direct Up to chip thickness touch. Thread and thewith 0.5mm or smaller is soldering iron solder components without direct Up to chip thickness Soldering iron 3mm or smaller should be required. required for soldering. touch. Thread solder with 0.5mm or smaller is And it is necessary to keep a distance between the required for soldering. soldering iron and the components without direct Up to chip thickness touch. Thread solder with 0.5mm or smaller is required for soldering. Excessive output of ultrasonic oscillation during cleaning causes PCBs case, in resulting circuit chips or Failure to follow the above cautions may result, worst to resonate,a short in cracked and /or broken solder. Take note not is cautions Failure when the product to vibrate PCBs. may result, worst case, in a short circuit and /or fuming to follow the above in use. fuming when the product is in use. Failure to follow the above cautions may result, worst case, in a short circuit and /or FAILURE To FoLLoW THE ABoVE CAUTIoNS MAy RESULT, fuming when the product is in use. WoRST CASE, IN A SHoRT CIRCUIT AND/oR FUMING (5) For Microstrip Types (MA22/62 Type) (5) Solder 1mm away from the ribbon terminal base, being careful that the solder tip does not directly contact the For Microstrip Types (MA22/62 Type) Capacitor. Preheating isthe ribbon terminal base, being careful that the solder tip does not directly contact the Solder 1mm away from unnecessary. Complete soldering within 3 seconds with a soldering tip less than 270 in temperature. Capacitor. Preheating is unnecessary. (5) For Microstrip Types (MA22/62 Type) Complete soldering within 3 seconds with a soldering tip less than 270 in temperature. Solder 1mm away from the ribbon terminal base, being careful that the solder tip does not directly contact the Washing Preheating is unnecessary. Capacitor. Washing soldering within 3 seconds withduring cleaning less than 270 in temperature. Excessive Complete output of ultrasonic oscillation a soldering tip causes PCBs to resonate, resulting in cracked chips or Excessive output of ultrasonic oscillation during cleaning causes PCBs to resonate, resulting in cracked chips or broken solder. Take note not to vibrate PCBs. broken solder. Take note not to vibrate PCBs. Washing WHEN THE PRoDUCT IS IN USE. 88 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Soldering and Mounting NOTICE 1.PCB Design Notice for Pattern Forms Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height. There is a possibility the chip may crack by the expansion and shrinkage of metal board. Please contact us if you want to use the ceramic capacitor on metal board such as Aluminum. Pattern Forms Placing Close to Chassis Chassis Solder(Ground) prohibited Electrode pattern Solder resist Correct Placing of Chip Components and Leaded Components Lead wire Placing of Leaded Components after Chip Component Soldering iron Lead wire Lateral Mounting Soldering and Mounting (2) Land Dimensions Chip Capacitor c Land Solder Resist b a Table 1 Flow Soldering Method Dimensions Part Number MA1*/MA5* Dimensions (LxW) 1.4x1.4 0.5 0.8 0.8 0.9 1.0 in: mm 1.2 in: mm Table 2 Reflow Soldering Method Dimensions Part Number MA1*/MA5* MA2*/MA6* Dimensions (LxW) 1.4x1.4 2.8x2.8 0.4 1.8 0.8 2.1 0.6 0.7 0.8 0.9 1.0 2.2 1.2 2.6 Continued on the following page. Continued from the preceding page. C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 89 MA Series Solder resist Solder resist Solder resist A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Soldering and Mounting 2. Adhesive Application Thin or insufficient adhesive causes chips to loosen or become disconnected when flow soldered. The amount of adhesive must be more than dimension c shown in the drawing below to obtain enough bonding strength. The chip's electrode thickness and land thickness must be taken into consideration. Low viscosity adhesive causes chips to slip after mounting. Adhesive must have a viscosity of 5000pa-s(500ps)min. (at 25C) a 20-70m b 30-35m c 50-105m a c b Chip Capacitor Board Adhesive Land 3. Adhesive Curing Insufficient curing of the adhesive causes chips to disconnect during flow soldering and causes deteriorated insulation resistance between outer electrodes due to moisture absorption. Control curing temperature and time in order to prevent insufficient hardening. Inverting the PCB Make sure not to impose an abnormal mechanical shock on the PCB. 4. Flux Application An excessive amount of flux generates a large quantity of flux gas, causing deteriorated solderability. So apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering). Flux containing too high a percentage of halide may cause corrosion of the outer electrodes unless sufficiently cleaned. Use flux with a halide content of 0.2% max. But do not use strongly acidic flux. Wash thoroughly because water-soluble flux causes deteriorated insulation resistance between outer electrodes unless sufficiently cleaned. 5. Flow Soldering Set temperature and time to ensure that leaching of the outer electrode does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown below) and 25% of the length A-B shown below as mounted on substrate. As a Single Chip B CB MA Series A DA Outer Electrode As Mounted on Substrate Others 1. Resin Coating When selecting resin materials, select those with low contraction. 2. Circuit Design These capacitors in this catalog are not safety recognized products. 3. Remarks The above notices are for standard applications and conditions. Contact us when the products are used in special mounting conditions. Select optimum conditions for operation as they determine the reliability of the product after assembly. 1. Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2. Your are requested not to use our product deviating from this product specificaiotn. 3. Please return one copy of these specifications upon your acceptance. If the copy is not returned by a day mentioned, the specifications will be deemed to have been accepted. 4. We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents. Therefore, if your technical documents as above include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement liability clause, they will be deemed to be invalid. NOTE 90 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors DESIGN ENGINEERING Kits MA Design Engineering KITS CERAMIC CHIP CAPACITORS ASCAP Hi-Frequency 0505 (150 VDC) Miniature sizes (0505 and 1111) Very high Q at high frequency High RF power capabilities Impervious to environmental conditions Low noise Base stations and RF power supplies 1111 (50 to 500 VDC) Miniature sizes (0505 and 1111) Very high Q at high frequency High RF power capabilities Impervious to environmental conditions Low noise Base stations and RF power supplies MA19-HIQ0505KIT- ENo. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 Description 0505/P090/0.3pF/150V 0505/P090/0.5pF/150V 0505/P090/0.7pF/150V 0505/P090/1.0pF/150V 0505/P090/1.2pF/150V 0505/P090/1.5pF/150V 0505/P090/1.8pF/150V 0505/P090/2.2pF/150V 0505/P090/2.7pF/150V 0505/P090/3.3pF/150V 0505/P090/3.9pF/150V 0505/P090/4.7pF/150V 0505/P090/5.6pF/150V 0505/P090/6.8pF/150V 0505/P090/8.2pF/150V 0505/P090/10pF/150V 0505/P090/12pF/150V 0505/P090/15pF/150V 0505/P090/18pF/150V 0505/P090/22pF/150V 0505/P090/27pF/150V 0505/P090/33pF/150V 0505/P090/39pF/150V 0505/P090/47pF/150V 0505/P090/56pF/150V 0505/P090/68pF/150V 0505/P090/82pF/150V Murata Global P/N MA190R3BAB MA190R5BAB MA190R7BAB MA191R0BAB MA191R2CAB MA191R5CAB MA191R8CAB MA192R2CAB MA192R7CAB MA193R3CAB MA193R9CAB MA194R7CAB MA195R6DAB MA196R8DAB MA198R2DAB MA19100JAB MA19120JAB MA19150JAB MA19180JAB MA19220JAB MA19270JAB MA19330JAB MA19390JAB MA19470JAB MA19560JAB MA19680JAB MA19820JAB Qty. 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 MA29-HIQ1111KIT- ENo. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Description 1111/P090/0.3pF/500V 1111/P090/0.5pF/500V 1111/P090/0.7pF/500V 1111/P090/1.0pF/500V 1111/P090/1.2pF/500V 1111/P090/1.5pF/500V 1111/P090/1.8pF/500V 1111/P090/2.2pF/500V 1111/P090/2.7pF/500V 1111/P090/3.3pF/500V 1111/P090/3.9pF/500V 1111/P090/4.7pF/500V 1111/P090/5.6pF/500V 1111/P090/6.8pF/500V 1111/P090/8.2pF/500V 1111/P090/10pF/500V 1111/P090/12pF/500V 1111/P090/15pF/500V 1111/P090/18pF/500V 1111/P090/22pF/500V 1111/P090/27pF/500V 1111/P090/33pF/500V 1111/P090/39pF/500V 1111/P090/47pF/500V 1111/P090/56pF/500V 1111/P090/68pF/500V 1111/P090/82pF/500V 1111/P090/100pF/500V 1111/P090/150pF/300V 1111/P090/220pF/200V 1111/P090/330pF/200V 1111/P090/470pF/200V 1111/P090/680pF/50V 1111/P090/1000pF/50V Murata Global P/N MA290R3BAB MA290R5BAB MA290R7BAB MA291R0BAB MA291R2CAB MA291R5CAB MA291R8CAB MA292R2CAB MA292R7CAB MA293R3CAB MA293R9CAB MA294R7CAB MA295R6DAB MA296R8DAB MA298R2DAB MA29100JAB MA29120JAB MA29150JAB MA29180JAB MA29220JAB MA29270JAB MA29330JAB MA29390JAB MA29470JAB MA29560JAB MA29680JAB MA29820JAB MA29101JAB MA29151JAB MA29221JAB MA29331JAB MA29471JAB MA29681JAB MA29102JAB Qty. 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 NOTE: Custom MA20 (non-magnetic) kits are available for MRI and other Medical applications. For availability, check with your Murata Sales Contact. C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 91 MA Series A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors DESIGN ENGINEERING Kits MA Design Engineering KITS CERAMIC CHIP CAPACITORS ASCAP Hi-Frequency 0505 (150 VDC) Miniature sizes (0505 and 1111) Very high Q at high frequency High RF power capabilities Impervious to environmental conditions Low noise Base stations, MRI systems and RF power supplies 1111 (50 to 500 VDC) Miniature sizes (0505 and 1111) Very high Q at high frequency High RF power capabilities Impervious to environmental conditions Low noise Base stations, MRI systems and RF power supplies MA59-HIQ0505KIT- ENo. 1 2 3 4 5 6 7 8 9 10 11 12 13 Description 0505/C0G/1pF/150V 0505/C0G/1.5pF/150V 0505/C0G/2.2pF/150V 0505/C0G/3.3pF/150V 0505/C0G/4.7pF/150V 0505/C0G/6.8pF/150V 0505/C0G/10pF/150V 0505/C0G/15pF/150V 0505/C0G/22pF/150V 0505/C0G/33pF/150V 0505/C0G/47pF/150V 0505/C0G/68pF/150V 0505/C0G/100pF/150V Murata Global P/N MA591R0BAB MA591R5CAB MA592R2CAB MA593R3CAB MA594R7CAB MA596R8DAB MA59100JAB MA59150JAB MA59220JAB MA59330JAB MA59470JAB MA59680JAB MA59101JAB Qty. 5 5 5 5 5 5 5 5 5 5 5 5 5 MA69-HIQ1111KIT- ENo. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Description 1111/C0G/1.5pF/500V 1111/C0G/2.2pF/500V 1111/C0G/3.3pF/500V 1111/C0G/4.7pF/500V 1111/C0G/6.8pF/500V 1111/C0G/10pF/500V 1111/C0G/15pF/500V 1111/C0G/22pF/500V 1111/C0G/33pF/500V 1111/C0G/47pF/500V 1111/C0G/68pF/500V 1111/C0G/100pF/500V 1111/C0G/220pF/200V 1111/C0G/470pF/200V 1111/C0G/1000pF/50V Murata Global P/N MA691R5CAB MA692R2CAB MA693R3CAB MA694R7CAB MA696R8DAB MA69100JAB MA69150JAB MA69220JAB MA69330JAB MA69470JAB MA69680JAB MA69101JAB MA69221JAB MA69471JAB MA69102JAB Qty. 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 DESIGN ENGINEERING KITS MA Series 92 - Innovator in Electronics w w w . m u r a t a . c o m C-29-C A p p l i c At i o n S p e c i F i c c A pA c i t o r S High Frequency Ceramic Capacitors MA Notes C-29-C w w w . m u r a t a . c o m Innovator in Electronics - 93 MA Series |
Price & Availability of MA18680GBB
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